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Capability Specification | Standard | Readily available, no consultation needed. | | Tight | Within capability, may be design dependent or require slightly longer lead-time. | | Development | Entirely design dependent and only available after consultation. |
| Definition | Standard | Tight | Development | | Base Material | FR4 (Tg 135) | | | | | FR4 (Tg > 150) | | | | | Rogers 4003 | | | | | Rogers 4350 | | | | | Rogers RT/Duroid | | | | | PTFE | | | | | Polyimide | | | | | | | | | Surface Finish | Lead Free HASL | Immersion Silver | Carbon Ink | | | ENIG (Immersion Gold) | Standard HASL | | | | Electroytic Gold (Hard) | Immersion Tin | | | | Ohmegaply | | | | | | | | | Solder Resists | Green | | | | | Red | | | | | Blue | | | | | Black | | | | | Clear | | | | | Pyralux (coverlay) | | | Minimum Feature | 0.1mm | | 0.076mm | | | | | | | Legend | White | | | | | Yellow | | | Minimum Feature | 0.154mm | | | | | | | | | Peelable Resist | Blue | | | | | | | | | Maximum PCB Size | 267 x 432mm | 267 x 483mm | | | | | | | | Minimum Track & Gap | 0.127mm | 0.108mm | 0.076mm | | | | | | | Maximum Aspect Ratio | 8:1 | | | | | | | | | Maximum PCB Thickness | 3.20mm | | | | | | | | | Minimum PCB Thickness | | | | 2 Layer | 0.20mm | | | 4 Layer | 0.50mm | | | 6 Layer | 0.70mm | | | 8 Layer | 1.00mm | | | 10 Layers + | 1.27mm | | | | | | | | | Maximum Copper Weight | | | | Inner Layers | 3oz | | | Outer Layers | 4oz | | | | | | | | | Minimum Hole (Drilled) | 0.25mm | 0.20mm | | | | | | | | Minimum Plated Slot (Dia.) | 0.45mm | | | | | | | | | Minimum Annular Ring | 0.127mm | 0.108mm | 0.076mm | | | | | | | Min. Inner Layer Clearance | 0.254mm | | 0.216mm | | | | | | | Min. Dist. Feature to Profile | 0.254mm | | |
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Capabilities 
