Standard Materials
FR4 (Tg 135),FR4 (Tg >150), Rogers 4350, Rogers 4003, Rogers Rt/Duriod,
Others on request. |
Metallic Finishes.
Hot Air Solder Levelled, Electroless Nickel - Gold, Immersion Tin, Immersion Silver. Carbon Ink, Others on request. |
Solder Resist.
All Photoimagable:- Green, Blue, Red, Black, Clear.
Component Idents:- White, Yellow.
Peelable Mask. |
Board Dimensions | Inches | Metric |
|
Maximum Board Size | 10.5" x 17" [1] | 266.70 x 431.80mm |
|
Maximum Board Thickness | 0.126" | 3.2mm |
|
Minimum Board Thickness
D/S | 0.008" | 0.2mm |
|
4 Layers | 0.020" | 0.5mm |
|
6 Layers | 0.028" | 0.7mm |
|
8 Layers | 0.040" | 1.0mm |
|
10 Layers and over | 0.050" | 1.27mm |
Copper Cladding. |
|
Inner Layers.
Maximum Copper weight. | 3oz. |
|
Outer Layers
Maximum Copper weight. | 4oz. |
|
Minimum Conductor Widths.
Minimum Conductor Spacing. | 0.005" [2]
0.005"
[2] | 0.127mm
0.127mm |
|
Maximum aspect ratio. | 8:1 | (0.20mm holes in a
1.6mm thick board). |
|
Minimum Drilled Hole size. | 0.008" | 0.20mm. |
|
Minimum Plated slot diameter. | 0.018" | 0.45mm |
|
Minimum annular ring. | 0.005" | 0.127mm |
|
Minimum Inner layer clearance. | 0.010" | 0.254mm |
|
Minimum feature to board outline. | 0.010" | 0.254mm |
|
Minimum distance Pad to Pad On resist | 0.004" | 0.1mm |
|
Minimum Text on Silkscreens | 0.006" | 0.15mm |
|
Controlled Impedance Testing |
|
Notes:
[1] Larger sizes available on request.
[2] 0.004" 0.10mm Track and Gap available. Electronic data required at
quoting stage.
Buried via’s, Blind via’s and sequential build up boards (SBU) also available. Please consult our Technical Director for more information. |
Where your requirement differ from our standard capability please consult our Technical Director. |
